1. SIM8300G-M2(SUB-6G, mmWave)

The SIM8300G-M2 is the Multi-Band 5G NR/LTE-FDD/LTE-TDD/HSPA+ module  which supports

R15 5G NSA/SA up to 7Gbps data transfer.  SIM8300G-M2 adopts M.2 form factor, TYPE 3052-D3-B.


AT commands of SIM8300G-M2 are compatible with SIM7912G/SIM8200-M2 series modules.

This also minimizes the investments of customers and enables a short time-to-market.


It is designed for applications that need high throughput data communication in a variety of

radio propagation conditions.


Due to the unique combination of performance, security and flexibility,

this module is ideally suited for many applications.



2. Product Advantage

• Standard M.2 interface

• High throughput data communication

• AT commands of SIM8300G-M2 are compatible with SIM7912G/SIM8200-M2 series modules






3. Product Details


General Features

Items Specification
Wireless Standard mmWave/Sub‐6G/LTE‐FDD/LTE‐TDD/WCDMA
Supply voltage range 3.135V~ 4.4V
Host Control Control Via AT Commands
Operation temperature -30℃ ~ +70℃
Dimensions 52.0*30.0*3.65mm
HW Interface USB2.0/3.1, UART, USIM(1.8V/2.95V), PCM, I2C, GPIOs, PCIe Gen3, Antennax14



Frequency Bands

5G mmWave n257,n258,n260,n261
5G Sub-6G  n1,n2,n3,n5,n7,n8,n12,n20,n25,n28,n40,n41,n66,n71,n77,n78,n79
LTE-FDD B1/B2/B3/B4/B5/B7/B8/B12/B13/B14/B17/B18/B19/B20/B25/B26/B28/B29/B30/B66/B71
LTE-TDD B34/B38/B39/B40/B41/B42/B46/B48
WCDMA B1/B2/B3/B4/B5/B8




  mmWave Sub‐6G LTE Cat20+ HSPA+
Uplink @max 3 Gbps 1 Gbps 200Mbps 5.76Mbps
Downlink @max 7 Gbps 4 Gbps 2 Gbps 42 Mbps



Other Features

• USB Driver for Microsoft Windows Win7/Win8/Win10
• USB Driver for Linux /Android
• RIL supporting for Android 6.0/7.0/8.0/9.0
• Firmware update via USB
• DTMF (Sending and Receiving)









4. File Download

§ SIM8300G-M2 (simcom.com)